Latch mechanisms for modules

ABSTRACT

Latch mechanisms for modules are disclosed. A module includes a housing and a release slide. The housing includes a first rib located on a first side of the housing and a second rib located on a second side of the housing. The release slide is slidingly positioned on the housing. The release slide includes a release slide base, a first release slide arm extending from the release slide base, and a second release slide arm extending from the release slide base. A first flange extending from the first release slide arm is positioned at least partially over the first rib. A second flange extending from the second release slide arm is positioned at least partially over the second rib.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.14/296,943, filed Jun. 5, 2014, which claims priority to U.S.Provisional Application No. 61/954,294, filed Mar. 17, 2014, titledLATCH MECHANISM FOR MODULES, both which are incorporated herein byreference in their entirety.

FIELD

The embodiments discussed herein relate generally to communicationmodules. More particularly, example embodiments relate to latchmechanisms for selectively engaging communication modules with a housingof a host device.

BACKGROUND

Electronic modules, such as transceiver or transponder modulesconfigured to transmit and receive electrical or optical data signals,are used in electronic and optoelectronic communication. Some modulesare pluggable, which permits the module to be inserted into and removedfrom a receptacle of a host device, such as a host computer, switchinghub, network router, or switch box. Some host devices include multiplereceptacles and can therefore accommodate multiple modulessimultaneously. Each module typically communicates with a printedcircuit board of the host device by transmitting and/or receivingelectrical signals to and/or from the host device printed circuit board.These electrical signals can also be transmitted by or to the moduleoutside the host device as optical and/or electrical signals.

The subject matter claimed herein is not limited to embodiments thatsolve any disadvantages or that operate only in environments such asthose described above. Rather, this background is only provided toillustrate one example technology area where some embodiments describedherein may be practiced.

SUMMARY

The embodiments discussed herein relate generally to communicationmodules. More particularly, example embodiments relate to latchmechanisms for selectively engaging communication modules with a housingof a host device.

This Summary introduces a selection of concepts in a simplified formthat are further described below in the Detailed Description. ThisSummary is not intended to identify key features or essentialcharacteristics of the claimed subject matter, nor is it intended to beused as an aid in determining the scope of the claimed subject matter.

In an example, a module includes a housing and a release slide slidinglypositioned at least partially on the housing. The housing includes afirst rib located on a first side of the housing and a second riblocated on a second side of the housing positioned opposite the firstside of the housing. The release slide includes a release slide base, afirst release slide arm extending from the release slide base, and asecond release slide arm extending from the release slide base. Thefirst release slide arm is at least partially positioned on the firstside of the housing and the second release slide arm is at leastpartially positioned on the second side of the housing. A first flangeextends from the first release slide arm and is positioned at leastpartially over the first rib. A second flange extends from the secondrelease slide arm and is positioned at least partially over the secondrib.

In another example, a module includes a housing, a release slideslidingly positioned at least partially on the housing, and a handlecoupled to a coupling structure of the release slide. The housingincludes a depression formed in the housing relative to outer surfacesof the housing, a face adjacent to the depression, channels formed inthe housing, a first rib, and a second rib. The first rib is locatedentirely within the depression on a first side of the housing. Thesecond rib is located entirely within the depression on a second side ofthe housing positioned opposite the first side of the housing. Therelease slide includes a release slide base, fingers extending from therelease slide base, a first release slide arm extending from the releaseslide base, and a second release slide arm extending from the releaseslide base. The fingers are positioned at least partially within thechannels formed in the housing. The first release slide arm is at leastpartially positioned on the first side of the housing and the secondrelease slide arm is at least partially positioned on the second side ofthe housing. A first flange extends from the first release slide arm andis positioned at least partially over the first rib. A second flangeextends from the second release slide arm and is positioned at leastpartially over the second rib. The release slide is selectively slidablebetween a latched position and an unlatched position. The face of thehousing is positioned to arrest sliding movement of the release slide ina first direction by way of contact with the release slide. The channelsformed in the housing are positioned to arrest sliding movement of therelease slide in a second direction by way of contact with the fingersof the release slide.

Additional features and advantages will be set forth in the descriptionwhich follows, and in part will be obvious from the description, or maybe learned by the practice of the embodiments. The features andadvantages of the embodiments will be realized and obtained by means ofthe instruments and combinations particularly pointed out in the claims.These and other features will become more fully apparent from thefollowing description and claims, or may be learned by the practice ofthe embodiments as set forth hereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS

To further clarify the above and other advantages and features of thepresent invention, a more particular description of the invention willbe rendered by reference to specific embodiments thereof which areillustrated in the appended drawings. It is appreciated that thesedrawings depict only typical embodiments of the invention and aretherefore not to be considered limiting of its scope. The invention willbe described and explained with additional specificity and detailthrough the use of the accompanying drawings in which:

FIG. 1A is a top perspective view of portions of an example host devicewith an example optoelectronic module in a latched configuration locatedpartially inside the example host device;

FIG. 1B is a bottom perspective view of the portions of the host deviceof FIG. 1A with the optoelectronic module in the latched configuration;

FIG. 2A is top perspective view of portions of the optoelectronic moduleof FIG. 1A in the latched configuration and with portions of theoptoelectronic module omitted;

FIG. 2B is a bottom perspective view of the optoelectronic module ofFIG. 2A in the latched configuration;

FIG. 3A is a side view of a portion of the host device of FIG. 1A withthe optoelectronic module in the latched configuration and with portionsof the optoelectronic module omitted;

FIG. 3B is a side view of the portion of the host device of FIG. 3A withthe optoelectronic module in an unlatched configuration;

FIG. 3C is a cutaway side view of the portion of the host device of FIG.3A with the optoelectronic module in the latched configuration;

FIG. 3D is a cutaway side view of the portion of the host device of FIG.3A with the optoelectronic module in the unlatched configuration;

FIG. 3E is an exploded top perspective view of a portion of a front endsection of the optoelectronic module of FIG. 3A;

FIG. 3F is an exploded bottom perspective view of a portion of the frontend section of the optoelectronic module of FIG. 3A;

FIG. 4A is an exploded top perspective view of another exampleoptoelectronic module;

FIG. 4B is an exploded bottom perspective view of the optoelectronicmodule of FIG. 4A;

FIG. 5A is a top perspective view of portions of another example hostdevice with another example optoelectronic module in a latchedconfiguration located partially inside the example host device;

FIG. 5B is a bottom perspective view of the host device of FIG. 5A withthe optoelectronic module in the latched configuration;

FIG. 6A is a top perspective view of portions of the optoelectronicmodule of FIG. 5A in the latched configuration with the host deviceomitted;

FIG. 6B is a bottom perspective view of the optoelectronic module ofFIG. 6A in the latched configuration;

FIG. 7A is a side view of the example host device of FIG. 5A with theoptoelectronic module in the latched configuration and with portions ofthe optoelectronic module omitted;

FIG. 7B is a side view of the host device of FIG. 7A with theoptoelectronic module in an unlatched configuration;

FIG. 7C is a cutaway side view of the portion of the host device of FIG.7A with the optoelectronic module in the latched configuration;

FIG. 7D is a cutaway side view of the portion of the host device of FIG.7A with the optoelectronic module in the unlatched configuration;

FIG. 7E is an exploded top perspective view of the portion of theoptoelectronic module of FIG. 7A; and

FIG. 7F is an exploded bottom perspective view of the portion of theoptoelectronic module of FIG. 7A.

DESCRIPTION OF EMBODIMENTS

Example embodiments relate to latch mechanisms for selectively engagingcommunication modules with host devices. Example embodiments also relateto modules such as communication modules that include latch mechanismsfor selectively engaging the communication modules with host devices.

Embodiments described herein may include fewer and/or less complexparts, and may allow for simplified assembly compared to traditionallatch mechanisms. Furthermore, components of the latch mechanism may bemanufactured via less complex, less expensive, and/or lesstime-consuming manufacturing processes relative to traditional latchmechanisms. For at least these reasons, some embodiments may be lessexpensive and/or less expensive to implement relative to traditionallatch mechanisms.

Embodiments described herein may alternatively or additionally reduce,and potentially may eliminate, undesired motions of a latch mechanismrelative to a housing of the module. For example, embodiments describedherein may reduce undesired looseness in the latch mechanism compared totraditional latch mechanisms. Embodiments may exhibit reduced rockingand/or rolling motions of the latch mechanism compared to traditionallatch mechanisms.

In some embodiments, the latch mechanism may include a release slidewith an interfacing portion having a low profile relative to a housingof a module. The low height of the interfacing portion of the releaseslide relative to the housing may reduce the mechanical loosenessbetween the release slide and the housing.

Reference will now be made to the figures wherein like structures willbe provided with like reference designations. The drawings arediagrammatic and schematic representations of exemplary embodiments and,accordingly, are not limiting of the scope of the claimed subjectmatter, nor are the drawings necessarily drawn to scale. Many of thefeatures of the disclosed embodiments may be substantially symmetricaland/or may be arranged symmetrically and a pluralized reference to afeature may refer to a pair of similar features of which only one may belabeled in the drawings.

1. Example Host Device and Communications Module

FIGS. 1A and 1B are, respectively, top and bottom perspective views of aportion of an example host device 100 with an example optoelectronicmodule 200 in a latched configuration located at least partially insidethe host device 100. The optoelectronic module 200 includes a handle 204and is coupled to a fiber optic cable 206.

FIGS. 2A and 2B are, respectively, top and bottom perspective views ofthe optoelectronic module 200 in the latched position and with one ormore portions of the optoelectronic module 200 omitted. For example, inFIGS. 2A and 2B, the handle 204 and the fiber optic cable 206 areomitted.

With combined reference to FIGS. 1A-2B, the optoelectronic module 200may be employed in the communication of optical signals and theconversion of optical signals to and from electrical signals. Inconnection, the host device 100 may be employed in the communication ofcorresponding electrical signals.

The optoelectronic module 200 may include a transmit port and/or areceive port (not shown) located within a port opening 212 (shown, e.g.,in FIG. 2A) at a front end section 201 of the optoelectronic module 200.The transmit port and/or the receive port may be in opticalcommunication with fibers of the fiber optic cable 206. Theoptoelectronic module 200 may be configured for optical signaltransmission and reception via the fiber optic cable 206 at a variety ofdata rates including, but not limited to, 1.25 Gb/s, 2.125 Gb/s, 2.5Gb/s, 4.25 Gb/s, 8.5 Gb/s, 10.3 Gb/s, 10.5 Gb/s, 11.3 Gb/s, 14.025 Gb/s,or 100 Gb/s or higher.

The optoelectronic module 200 may be configured for optical signaltransmission and reception at various wavelengths including, but notlimited to, 850 nm, 1310 nm, 1470 nm, 1490 nm, 1510 nm, 1530 nm, 1550nm, 1570 nm, 1590 nm, or 1610 nm. The optoelectronic module 200 may beconfigured to support various communication protocols including, but notlimited to, Optical Fast Ethernet, Optical Gigabit Ethernet, 10 GigabitEthernet, and 1×, 2×, 4×, 8×, and 16× Fibre Channel.

Although one example of the optoelectronic module 200 is configured tohave a form factor that is substantially compliant with an enhancedsmall form-factor pluggable (SFP+) multi-source agreement (MSA), theoptoelectronic module 200 may alternatively be configured in a varietyof different form factors that are substantially compliant with otherMSAs including, but not limited to, a small form-factor pluggable (SFP)MSA. Finally, although the optoelectronic module 200 is illustrated as apluggable optoelectronic transceiver module, example embodiments of thelatching mechanism disclosed herein may alternatively be employed, forexample, in connection with pluggable electronic transceiver modules,other pluggable electronic devices such as pluggable media drives, orthe like.

The host device 100 may include a cage 102 (shown, e.g., in FIG. 1A andFIG. 1B) configured to be connected to a host printed circuit board (notshown). The cage 102 at least partially receives the optoelectronicmodule 200 when the optoelectronic module 200 is inserted into the cage102 and is mechanically and electrically connected to the host device100. The cage 102 includes a cage recess 104. The cage recess 104 mayallow the optoelectronic module 200 to selectively engage the cage 102such that the optoelectronic module 200 is prevented from movingsignificantly within the cage 102 until the optoelectronic module 200 isintentionally disengaged from the cage 102. As a result, the mechanicaland electrical connection between the optoelectronic module 200 and thehost device may be maintained and unintentional disconnection may bereduced and potentially eliminated.

2. First Example Latching Mechanism

The optoelectronic module 200 includes an example latching mechanism.The latching mechanism is configured for use in selectively securing andreleasing the optoelectronic module 200 within a receptacle, such as thecage 102.

The optoelectronic module 200 may include a release slide 202.Optionally, the optoelectronic module 200 may include the handle 204coupled to the release slide 202. The release slide 202 may be formed invarious ways, including, but not limited to, being stamped from sheetmetal or molded from hard plastic.

The handle 204 may be formed from a polycarbonate material, though othersuitable materials may alternately or additionally be used. The handle204 may be rigid enough to generally maintain its shape, but capable ofbeing flexed by a user, for example, during extraction of theoptoelectronic module 200 from the cage 102.

The handle 204 may include a first end section 246 and a second endsection 247. The first end section 246 may be coupled to a couplingstructure 203 of the release slide 202. For example, the first endsection 246 of the handle 204 may be over-molded around the couplingstructure 203.

The handle 204 is configured to be manually pulled and pushed in orderto slide the release slide 202 between its latched position and itsunlatched position relative to a housing 208. Alternately oradditionally, the release slide 202 may be directly pulled and pushedbetween the latched position and the unlatched position. The releaseslide 202 may optionally be shaped to assist a user in gripping therelease slide 202 directly.

The housing 208 may include a top housing 209 and a bottom housing 210(shown, e.g., in FIGS. 2A and 2B) coupled together. The top housing 209may be removed from the bottom housing 210, e.g., to access an interiorof the optoelectronic module 200. The housing 208 may at least partiallysurround receiver and/or transmitter circuitry (not shown), including aprinted circuit board having an edge connector (not shown) configured tobe electrically coupled to the host device. The bottom housing 210and/or the top housing 209 may be die cast in zinc. Alternately oradditionally, the bottom housing 210 and/or the top housing 209 may bedie cast, or otherwise manufactured, from other suitable materials or acombination of other suitable materials.

The optoelectronic module 200 may include a conductive electromagneticinterference (EMI) shield 211 (shown, e.g., in FIGS. 2A and 2B) locatedat least partially around the housing 208. The EMI shield 211 may reducethe degree of electromagnetic interference created and/or experienced bythe optoelectronic module 200. The EMI shield 211 may include conductivefingers 213. The conductive fingers 213 may form an electricallyconductive connection with the cage 102.

The optoelectronic module 200 includes an engagement pin 207 (shown,e.g., in FIGS. 1B and 2B). The engagement pin 207 is configured toengage the cage recess 104 when the optoelectronic module 200 is in thelatched configuration. By engaging the cage recess 104, the engagementpin 207 may generally prevent the optoelectronic module 200 from movingsignificantly within the cage 102 until the engagement pin 207 and thecage recess 104 are intentionally disengaged from each other. Theengagement pin 207 and the cage recess 104 may be disengaged from eachother when the optoelectronic module 200 is in the unlatchedconfiguration.

As used herein, the term “latched configuration” refers to theconfiguration of the optoelectronic module 200 that results in theengagement pin 207 being engageable with the cage 102. The components ofthe optoelectronic module 200 are referred to herein as being in a“latched position” when the optoelectronic module 200 is in the latchedconfiguration. Conversely, as used herein, the term “unlatchedconfiguration” refers to the configuration of the optoelectronic module200 that results in the engagement pin 207 not being engageable with thecage 102. The components of the optoelectronic module 200 are referredto herein as being in an “unlatched position” when the optoelectronicmodule 200 is in the unlatched configuration.

In addition, the optoelectronic module 200 may include a front, a rear,a top, a bottom, and two opposing sides. The front of the optoelectronicmodule 200 may generally refer to an end of the optoelectronic module200 within which the port opening is defined. The rear of theoptoelectronic module 200 may generally refer to an end of theoptoelectronic module 200 opposite the front. The bottom of theoptoelectronic module 200 may generally refer to a surface of theoptoelectronic module 200 from which the engagement pin 207 extends whenin its latched position. The top of the optoelectronic module 200 maygenerally refer to a surface of the optoelectronic module 200 that isopposite the bottom. The two opposing sides of the optoelectronic modulemay generally refer to surfaces of the optoelectronic module 200 thatconnect the top to the bottom.

Use of the terms front, rear, top, and bottom, and/or up, down, forward,backward, and other directional terms as applied to the optoelectronicmodule 200, any of its components, and/or other embodiments illustratedin FIGS. 4A-7F may be interpreted in view of the foregoing convention.For example, the first end section 246 of the handle 204 may alternatelybe referred to as a rear end section of the handle 204, while the secondend section 247 of the handle may alternately be referred to as a frontend section of the handle 204. Alternately or additionally, the secondend section 247 of the handle 204 may be described as being locatedforward of the first end section 246, and/or the first end section 246may be described as being located rearward of the second end section247.

FIG. 3A is a side view of the host device 100 with the optoelectronicmodule 200 in the latched configuration and with the fiber optic cable206, the handle 204, and portions of the housing 208 omitted. FIG. 3B isa side view of the host device 100 of FIG. 3A with the optoelectronicmodule 200 in the unlatched configuration.

FIG. 3C is a cutaway view of the host device 100 with the optoelectronicmodule 200 in the latched configuration. FIG. 3D is a cutaway view ofthe host device 100 with the optoelectronic module 200 in the unlatchedconfiguration.

FIGS. 3E and 3F are, respectively, top and bottom exploded perspectiveviews of a portion of the front end section 201 of the optoelectronicmodule 200.

With combined reference to FIGS. 3A-3F, in some embodiments, the housing208 may include a pair of ribs 236 (FIGS. 3B, 3E, and 3F) located onopposite sides of the housing 208. For example, the bottom housing 210may include a first of the ribs 236 formed on a first side of the bottomhousing 210 and a second of the ribs 236 formed on a second side of thebottom housing 210 opposite the first side. In some embodiments, theribs 236 may include elongate protrusions. Alternately or additionally,the ribs 236 and/or the housing 208 may be sized and shaped to formguides 237 (FIGS. 3B, 3E, and 3F).

In some embodiments, the ribs 236 may be located in a depression 216(FIGS. 3A, 3B, 3E, and 3F) relative to outer surfaces 217 (FIGS. 3A, 3B,3E, and 3F) of the housing 208. Alternately or additionally, the ribs236 may not extend beyond the outer surfaces 217 of the housing 208,e.g., the ribs 236 may be located entirely within the depression 216relative to the outer surfaces 217. Alternately, the ribs 236 may extendbeyond the outer surfaces 217.

The release slide 202 may include a release slide base 238 (FIGS. 3D-3F)and a pair of release slide arms 240 (FIGS. 3A, 3B, 3E, and 3F)extending from the release slide base 238. The release slide arms 240may extend upward from the release slide base 238 parallel orsubstantially parallel to each other. In some embodiments, the releaseslide 202 includes flanges 242 (FIGS. 3E and 3F). The flanges 242 may belocated on the release slide arms 240. Alternately or additionally, theflanges 242 may extend from the release slide arms 240 inwardly towardseach other.

In some embodiments, the flanges 242 may be substantially coplanar. Insome embodiments, the flanges 242 may include elongate shelf structures.Alternately, each of the flanges 242 may include one or more fingers(not shown) or the like.

The flanges 242 and the release slide arms 240 may be sized and shapedto form tracks 244 (FIGS. 3E and 3F) sized and shaped to fit on and/oraccommodate the ribs 236. Each of the flanges 242 may be positioned atleast partially over a corresponding one of the ribs 236. The releaseslide base 238 may be positioned at least partially under the ribs 236.In some embodiments, the flanges 242 may fit at least partially withinthe guides 237.

The ribs 236, the release slide arms 240, and the flanges 242 are sizedand shaped to allow the release slide 202 to slide relative to thehousing 208. In some embodiments, the ribs 236 may be sized andpositioned such that the portion of the release slide arms 240 that fitsover the ribs 236 may have a low profile relative to a height of thehousing 208 where the ribs 236 are located. In some embodiments, the lowprofile of the portion of the release slide arms 240 that fits over theribs 236 and the configuration of the ribs 236 may reduce sensations oflooseness of the release slide 202 relative to the housing 208.

In some embodiments, the flanges 242, the release slide arms 240, and/orthe release slide base 238 may form a close fit with the ribs 236 and/orthe housing 208 such that the release slide 202 resists rocking androlling motions relative to the housing 208.

In some embodiments, the ribs 236 are positioned at least partially toone side of the port opening 212. For example, the ribs 236 may belocated at least partially below the port opening 212. In someembodiments, the ribs 236 may be located entirely to one side of theport opening 212. For example, as best seen in FIG. 3E, the ribs 236 maybe located entirely below the port opening 212.

With combined reference to FIG. 1A and FIG. 1B, the second end section247 of the handle 204 may be positioned at least partially to adifferent side of the port opening 212. Thus, the second end section 247may be located on a side of the port opening 212 and the fiber opticcable 206 (when present) different from the side of the optoelectronicmodule 200 including the engagement pin 207. For example, the engagementpin 207 may be located at the bottom of the optoelectronic module 200and the second end section 247 of the handle 204 may be located at thetop of the optoelectronic module 200.

With combined reference to FIGS. 3A-3F, the release slide 202 may fit atleast partially within the depression 216. In some embodiments, thedepression 216 may be sized and shaped such that outer surfaces 219(FIGS. 3A, 3B, 3E, and 3F) of the release slide 202 and the outersurfaces 217 of the housing 208 are substantially aligned or flush witheach other.

In some embodiments, the release slide 202 may include fingers 248(FIGS. 3A, 3B, 3E, and 3F) sized and shaped to be received incorresponding channels 250 (FIGS. 3A, 3B, 3E, and 3F) formed in thehousing 208. One or more of the fingers 248 may extend inward from theouter surfaces 219 and/or may extend upward from the release slide base238. Alternately or additionally, the corresponding channels 250 may beformed in corresponding locations of the housing 208. The fingers 248and the channels 250 may form a pull stop and/or a push stop for therelease slide 202 such that the sliding movement of the release slide202 is arrested by the fingers 248 contacting the ends of the channels250 when the release slide 202 reaches a latched position and/or anunlatched position.

Alternately or additionally, the housing 208 may include a face 252(FIGS. 3B and 3E) configured to form a push stop for the release slide202 such that the sliding movement of the release slide 202 is arrestedby the release slide 202 contacting the face 252 of the housing 208. Theface 252 may be positioned adjacent to the depression 216.

Alternately or additionally, the fingers 248 and the channels 250 mayreduce sensations of looseness of the release slide 202 relative to thehousing 208. For example, up and/or down movement, latitudinal movement,and/or rotational movement such as tipping, rocking, and/or rolling ofthe release slide 202 relative to the housing 208 may be arrested by thefingers 248 contacting sides and/or beds of the channels 250.

Optionally, the optoelectronic module 200 may include one or moreresilient members 254 (FIGS. 3E and 3F) configured to urge the releaseslide 202 to its latched position. In some embodiments the resilientmembers 254 may include coil compression springs. However, other typesof resilient members may alternatively or additionally be used. Forexample, the resilient members 254 may include one or more tensionsprings, torsion springs, leaf springs, cantilever springs, othercompression springs, or the like or any combination thereof. In someembodiments, the resilient members 254 may be formed as an integratedportion of the release slide 202.

In some embodiments, the resilient members 254 may be located at leastpartially within recesses 256 (FIG. 3F) formed in the housing 208.Alternately or additionally, each resilient member 254 may be located inthe corresponding recess 256 with a front end of the resilient member254 at or near a front wall of the corresponding recess 256 and a rearend of the resilient member 254 at or near a front surface of a finger258 (FIGS. 3E and 3F) that extends upward from the release slide base238. Thus, forward motion of the release slide base 238 relative to thehousing when the release slide base 238 is moved from the latchedposition towards the unlatched position may cause the fingers 258 tocompress the resilient members 254 within the recesses 256 against thefront walls of the recesses 256. When thus compressed, the compressedresilient members 254 may urge the release slide base 238 from itsunlatched position towards its latched position.

Stated another way, the resilient members 254 contact the housing 208and the release slide 202 such that the resilient members 254 areresiliently deformed when the release slide 202 is moved from itslatched position. For example, the front ends of the resilient members254 may contact the front walls of the recesses 256 and the rear ends ofthe resilient members 254 may contact the fingers 258 of the releaseslide 202 such that the resilient members 254 are resiliently compressedbetween the housing 208 and the release slide 202 as the release slide202 is moved from the latched position towards the unlatched position.The resilient members 254 may alternately or additionally contact a cam218 such that the resilient members 254 are resiliently deformed whenthe cam 218 is moved from its latched position towards its unlatchedposition.

In some embodiments, the release slide 202 may include openings 260sized to receive the resilient members 254 such that the resilientmembers 254 may be assembled into the optoelectronic module 200 assemblywith the release slide 202 positioned on the housing 208.

In some embodiments, the engagement pin 207 may be located on a firstend section 214 (FIGS. 3E and 3F) of a latch 205. The latch 205 may alsoinclude a second end section 215 (FIGS. 3E and 3F) that interfaces withthe cam 218. The cam 218 may interface with the release slide 202 suchthat the cam 218 rotates about a cam axis 220 as the release slide 202is moved relative to the housing 208. For example, the cam 218 mayrotate from a latched position to an unlatched position as the releaseslide 202 is moved from its latched position to its unlatched position.

The housing 208 may include seats 262 (FIG. 3F) configured to interfacewith the cam 218 such that the cam 218 may rotate about the cam axis 220as the optoelectronic module 200 is moved between its latchedconfiguration and its unlatched configuration. In some embodiments, thecam 218 may include substantially cylindrical-shaped sections 264 (FIGS.3E and 3F) that may interface with corresponding, suitably-shaped seats262. Alternately or additionally, other shapes and/or configurations ofthe cam 218 and/or the seats 262 may be used.

The cam 218 may include one or more first cam arms 266 (FIGS. 3A, 3B,3E, and 3F). The first cam arms 266 may include protrusions 268 (FIGS.3A, 3B, 3E, and 3F) radially offset from the cam axis 220. Theprotrusions 268 may be received in openings 270 (FIGS. 3E and 3F)located on the release slide arms 240 of the release slide 202. Theprotrusions 268 may include ramps 272 (FIGS. 3A, 3B, 3E, and 3F) toassist in assembly of the cam 218 and the release slide 202.

When the cam 218 rotates about the cam axis 220, the protrusions 268travel along a circular curve having a radius equal to the radial offsetof the protrusions 268 from the cam axis 220. Similarly, rotating theprotrusions 268 about the cam axis 220 causes the cam 218 to rotateabout the cam axis 220. Sliding motion of the release slide 202 maycause the cam 218 to rotate about the cam axis 220. In particular, asthe release slide 202 is slid forward or backward relative to thehousing 208 and the cam 218 seated in the seats 262, the openings 270engage the protrusions 268 and cause them to move forward or backwardwith the release slide 202. Because the cam 218 is seated in the seats262 of the housing, which may prevent translational movement of the cam218 relative to the housing 208, the forward and backward motion of theprotrusions 268 may be accommodated as rotation of the protrusions 268,and thus of the cam 218, about the cam axis 220. Although one embodimentof the optoelectronic module 200 may include protrusions 268 of the cam218 interfaced with the openings 270 on the release slide 202, the cam218 and the release slide 202 may be configured to interface in otherways that produce the same or similar motion of the cam 218 in responseto the release slide 202 being moved from its latched position to itsunlatched position.

The cam 218 may include a second cam arm 274 (FIGS. 3E and 3F). Thesecond cam arm 274 may include a seat 276 (FIGS. 3E and 3F) configuredto interface with a post 280 (FIGS. 3E and 3F) positioned on the secondend section 215 of the latch 205. The seat 276 may generally be radiallyoffset from the cam axis 220.

Optionally, the post 280 may include a tapered tip 282 (FIGS. 3E and 3F)on one side of the post 280 and the seat 276 may further be shaped toaid in assembling the latch 205 and the cam 218 to have a properassembled configuration. Alternately or additionally, other asymmetricalfeatures may be used in place of the tapered tip 282.

The cam 218 may include a slot 278 configured to at least partiallyreceive a neck 284 of the latch 205 when the optoelectronic module 200is in the latched configuration.

When the cam 218 rotates about the cam axis 220, the seat 276 travelsalong a circular curve having a radius equal to the radial offset of theseat from the cam axis 220. Rotation of the cam 218 may thus urge thepost 280 along the same or similar circular curve as the seat 276. Asthe cam 218 is rotated from its latched position to its unlatchedposition, the cam 218 may urge the second end section 215 of the latch205 outwards, e.g., away from a longitudinal midline of theoptoelectronic module 200, or downwards. The second end section 215 mayalso be urged towards the rear of the housing 208, e.g., towards the endof the optoelectronic module 200 opposite the front end section 201.

The motion of the second end section 215 of the latch 205 may urge thelatch 205 to rotate and slide relative to a crossbar 221 of the bottomhousing 210, thus urging the first end section 214 of the latch 205inwards, i.e., towards a longitudinal midline of the optoelectronicmodule 200 or upwards, and towards the rear of the housing 208. Thebottom housing 210 may include a recess 222 sized and shaped to receivethe latch 205 such that the engagement pin 207 disengages from the cagerecess 104 and allows the optoelectronic module 200 to be removed fromthe cage 102.

In some embodiments, the release slide 202 may include an opening 224sized and shaped to allow the second end section 215 of the latch 205 tomove farther outwards or downwards than might otherwise be allowed ifthe release slide 202 did not include the opening 224. For instance, asperhaps best illustrated in FIG. 3D, the opening 224 allows the secondend section 215 of the latch 205 to pass through a plane defined by therelease slide base 238. By allowing the second end section 215 to movefarther outwards, the first end section 214 may be allowed to movefarther inwards. Combined with the forward motion of the latch 205, theengagement pin 207 may therefore move from its latched position orengaged position (best seen in FIG. 3C) to its unlatched position ordisengaged position (best seen in FIG. 3D) within the space occupied bythe optoelectronic module 200 and in response to a relatively smallmovement of the release slide 202.

The movement of the engagement pin 207 in a direction at least partiallyopposite to the direction of the release slide 202 may provide a smoothand/or enjoyable extraction feel for a user removing the optoelectronicmodule 200. For example, the force provided on the release slide 202 maynot work against disengaging the engagement pin 207 from the cageopening 104.

As may be best understood with reference to FIG. 3C, the recess 222 andthe cam 218 may be further sized and shaped to allow the optoelectronicmodule 200 to be inserted into the cage 102 while the optoelectronicmodule 200 is in the latched configuration. As the optoelectronic module200 is inserted into the cage 102, the latch 205 may be urged to rotateinwards by the engagement pin 207 contacting a cage tab 106. In someembodiments, the inwards rotation of the latch 205 may be arrested by astop 226. As used herein “insertion position” describes an inward-mostposition of the latch 205 achieved when the optoelectronic module 200 isinserted into the cage 102 while in the latched configuration. As theoptoelectronic module 200 is further inserted into the cage 102, theengagement pin 207 may urge the cage tab 106 to protract or abducerelative to the cage 102, e.g., move away from a longitudinal midline ofthe cage 102 or downward, until the engagement pin 207 engages the cagerecess 104.

The engagement pin 207 may include a ramped leading surface, asillustrated at least in FIGS. 3C and 3D. The engagement pin 207 may alsoinclude a relatively abrupt trailing edge opposite the ramped leadingsurface. As the optoelectronic module 200 is inserted into the cage 102,the ramped leading surface of the engagement pin 207 may come in contactwith the cage tab 106. The ramped leading surface may allow theengagement pin 207 to relatively easily slide up the cage tab 106,causing the latch 205 to rotate such that the first end section 214rotates upwards and/or to relatively easily urge the cage tab 106downward as the optoelectronic module 200 is further inserted into thecage 102. At this point, the cage tab 106 may be resiliently bentdownward. After the trailing edge of the engagement pin 207 clears acorresponding trailing edge of the cage tab 106 (alternately referred toas a leading edge of the cage recess 104), the cage tab 106 may springupward, thereby causing the engagement pin 207 to “snap” into engagementwith the cage 102.

The optoelectronic module 200 may thus provide tactile feedback and/oraudio feedback to a user to indicate when the optoelectronic module 200has been inserted far enough into the cage 102 that the engagement pin207 is engaged with the cage recess 104. For example, a user mayexperience resistance as the engagement pin 207 is in contact with thecage tab 106 until the engagement pin 207 engages the cage recess 104,at which point the user may experience a sudden decrease in resistanceas the engagement pin 207 and the cage tab 106 may cease to resistivelycontact one another. Alternately or additionally, audio feedback, e.g.,in the form of a clicking sound, snapping sound, or the like maypotentially be generated as the cage tab 106 resiliently and suddenlyretracts or adduces relative to the cage 102, e.g., moves towards alongitudinal midline of the cage 102 (or upwards), and contacts thelatch 205.

As may be best seen in FIGS. 3C-3F, in some embodiments, the latch 205may include a protrusion 228 sized and shaped to be received by a saddle230 located on the crossbar 221 of the bottom housing 210. Alternatelyor additionally, the latch 205 may include a fin 232 sized and shaped tobe received by one or more trenches 234 formed in the recess 222 of thehousing 208. The fin 232 may add strength to the latch 205.

The saddle 230 may allow the engagement pin 207 to be positionedrelative to the housing 208 in assembly of the optoelectronic module200. The protrusion 228 may fill the saddle 230 and may encourage properassembly of the optoelectronic module 200. For example, the protrusion228 and the saddle 230 may prevent upside down or inverted assembly ofthe latch 205 with the housing 208.

The latch 205 may further include shoulders 286 configured to contactshoulders 288 of the housing when the latch 205 is in its latchedposition, its unlatched position, and/or its insertion position. Thecontact between the shoulders 286 and the shoulders 288 and/or thehousing 208 generally may encourage desired positioning of the latch 205for engaging and/or disengaging the cage recess 104.

As best seen in FIG. 1A and FIG. 1B, the second end section 247 of thehandle 204 may be positioned at least partially to a different side ofthe port opening 212 than the engagement pin 207. Thus, the second endsection 247 may be located on a side of the port opening 212 and thefiber optic cable 206 (when present) different from the side of theoptoelectronic module 200 including the engagement pin 207. For example,the engagement pin 207 may be located at the bottom of theoptoelectronic module 200 and/or below the port opening 212 and thesecond end section 247 of the handle 204 may be located at the top ofthe optoelectronic module 200 and/or above the port opening 212.

3. Second Example Latching Mechanism

FIGS. 4A and 4B are, respectively, top and bottom exploded perspectiveviews of a portion of a front end section of another exampleoptoelectronic module 300.

The optoelectronic module 300 may engage and/or disengage from a hostdevice cage (not shown) such as the cage 102 of FIGS. 1A-1B in a manneranalogous to the optoelectronic module 200 of FIGS. 1A-3F. Theoptoelectronic module 300 may include some elements that are similar oridentical to the elements of the optoelectronic module 200, such as theresilient members 254, the latch 205, the cam 218, and their associatedelements, for which a more detailed description is already providedabove.

The optoelectronic module 300 may include a bottom housing 301. Theoptoelectronic module 300 may further include a top housing (not shown)generally corresponding to the top housing 209 of the optoelectronicmodule 200 of FIGS. 1A-3F. The bottom housing 301 may include someelements that are similar or identical to the elements of the housing208 of FIGS. 1A-3F such as the crossbar 221, the recess 222, the saddle230, the trenches 234, the channels 250, the face 252, the recesses 256,the seats 262, and the shoulders 288, for which a more detaileddescription is already provided above.

The bottom housing 301 may include port openings 314 for reception ofcommunication cables, such as communication cables analogous to thefiber optic cable 206 of FIGS. 1A and 1B. The bottom housing 301 mayinclude a depression 312 analogous to the depression 216 of the housing208 of FIGS. 1A-4B. The depression 312 may be sized and shaped to atleast partially receive a release slide 302. In some embodiments, thedepression 312 may be sized and shaped to receive the release slide 302such that outer surfaces 315 of the release slide 302 are substantiallyaligned and/or flush with outer surfaces 316 of the bottom housing 301.

The bottom housing 301 may include ribs 320 and/or guides 322 that areanalogous, respectively, to the ribs 236 and the guides 237 of theoptoelectronic module 200.

The release slide 302 may be analogous to the release slide 202 of FIGS.1A-3F. The release slide 302 may include some elements that are similaror identical to the elements of the release slide 202, such as theflanges 242, the tracks 244, the fingers 248, the openings 260, theopenings 270, and the opening 224, for which a more detailed descriptionis already provided above.

The release slide 302 may include fingers 318 analogous to the fingers258 of the release slide 202. In some embodiments, the bottom housing301 may include openings 319 to allow the fingers 318 to be bent intoposition while the release slide 302 is located on the bottom housing301.

The optoelectronic module 300 may optionally include a handle 304. Thehandle 304 may include a first end section 306 coupled to the releaseslide 302. The handle 304 may further include a second end section 308.The second end section 308 may be positioned at least partially to asame side of the port openings 314 (and communication cable, whenpresent) as the engagement pin 207 and/or the ribs 320.

The release slide 302 may include a release slide base 309 and releaseslide arms 310 analogous, respectively, to the release slide base 238and the release slide arms 240 of the release slide 202. Theconfiguration of the release slide base 309 and the release slide arms310 may allow the handle 304 to be located substantially in line withthe release slide 302. Similarly, the forces for removing theoptoelectronic module 300 may be substantially inline and may minimizeup and/or down movement, latitudinal movement, and/or rotationalmovement such as tipping, rocking, and/or rolling of the release slide302 relative to the bottom housing 301 as the optoelectronic module 300is disengaged from the cage.

4. Third Example Latching Mechanism

FIGS. 5A and 5B are, respectively, top and bottom perspective views ofanother example host device 500 with another example optoelectronicmodule 400 in a latched configuration located at least partially insidethe host device 500.

The host device 500 includes some elements that are similar or identicalto elements of the host device 100 of FIGS. 1A and 1B, such as the cage102, the cage recess 104, and the cage tab 106.

The optoelectronic module 400 includes some elements that are similar oridentical to elements of the optoelectronic module 300 of FIGS. 4A and4B, such as the handle 304 and its associated elements, for which a moredetailed description is already provided above.

FIGS. 6A and 6B are, respectively, a top perspective view and a bottomperspective view of the optoelectronic module 400 with the handle 304omitted.

With combined reference to FIGS. 5A-6B, the optoelectronic module 400may be employed in the communication of optical signals and theconversion of optical signals to and from electrical signals in a mannersimilar to or the same as the optoelectronic module 200 of FIGS. 1A-4B.

The optoelectronic module 400 may include a housing 404 having a tophousing 406 and a bottom housing 408 analogous, respectively, to the tophousing 209 and the bottom housing 210 of the optoelectronic module 200of FIGS. 1A-4B. The optoelectronic module 200 may include elements thatare similar or identical to elements of the optoelectronic module 200 ofFIGS. 1A-4B, such as the port opening 212, the EMI shield 211, and theconductive fingers 213, for which a more detailed description is alreadyprovided above.

The optoelectronic module 400 includes another example latchingmechanism. The latching mechanism is configured for use in selectivelysecuring and releasing the optoelectronic module 200 within areceptacle, such as the cage 102. For example, a release slide 402 mayselectively protract the cage tab 106 relative to the cage 102 such thatthe cage recess 104 is disengaged from an engagement pin 407 of thehousing 404.

FIGS. 7A and 7B are side views of the host device 500 with theoptoelectronic module 400 in the latched configuration and the unlatchedconfiguration, respectively.

FIGS. 7C and 7D are cutaway side views of the host device 500 with theoptoelectronic module 400 in the latched configuration and the unlatchedconfiguration, respectively.

FIGS. 7E and 7F are, respectively, top and bottom exploded perspectiveviews of the optoelectronic module 400.

With combined reference to FIGS. 7A-7E, the optoelectronic module 400may include some elements that are similar or identical to the elementsof the optoelectronic module 200 of FIGS. 1A-4B, such as the resilientmembers 254 (FIGS. 7E and 7F), for which a more detailed description isalready provided above.

The housing 404 may include elements that are similar or identical toelements of the optoelectronic module 200, such as the channels 250(FIG. 7F), the face 252 (FIGS. 7B and 7E), and the recesses 256 (FIG.7F), for which a more detailed description is already provided above.

The housing 404 may include a depression 422 (FIGS. 7E and 7F) sized andshaped to at least partially receive the release slide 402. In someembodiments, the depression 422 may be sized and shaped to receive therelease slide 402 such that outer surfaces 412 (FIGS. 7A, 7B, 7E, and7F) of the release slide 402 are substantially aligned and/or flush withouter surfaces 410 (FIGS. 7A, 7B, 7E, and 7F) of the housing 404.

The housing 404 may further include ribs 432 (FIGS. 7A, 7E, and 7F)and/or guides 434 analogous (FIGS. 7A, 7E, and 7F), respectively, to theribs 236 and the guides 237 of the optoelectronic module 200. Therelease slide 402 may further include fingers 436 (FIGS. 7E and 7F)analogous to the fingers 258 of the release slide 202. In someembodiments, the housing 404 may include openings 438 (FIGS. 7E and 7F)sized to allow the fingers 436 to enter the recesses 256 during assemblyof the optoelectronic module 200. The openings 438 may further be sizedsuch that the resilient members 254 are retained within the recesses 256after being assembled into the optoelectronic module 200, e.g., afterbeing inserted through the openings 260 as the release slide 402 islocated on the housing 404. For example, the openings 438 may benarrower than a diameter of the resilient members 254.

The housing 404 includes the engagement pin 407 (FIGS. 7C-7E) configuredto engage the cage recess 104 (FIGS. 7C and 7D) on the cage tab 106(FIGS. 7B-7D) such that the optoelectronic module 400 is generallyprevented from moving significantly within the cage 102 (FIGS. 7A-7D)until the cage tab 106 is intentionally disengaged from the engagementpin 407. As the optoelectronic module 400 is inserted into the cage 102,the engagement pin 407 contacts the cage tab 106 and urges it toprotract.

The optoelectronic module 400 is configured to urge the cage tab 106 toprotract from the cage 102 such that the cage recess 104 disengages theengagement pin 207 when the optoelectronic module 400 is in theunlatched configuration.

The release slide 402 may be formed and may slide relative to thehousing 404 in a manner analogous to the release slide 202 of FIGS.1A-4B. The release slide 402 may further include some elements that aresimilar or identical to elements of the release slide 202 of FIGS.1A-4B, such as the fingers 248 (FIGS. 7E and 7F), and the openings 260(FIGS. 7E and 7F), for which a more detailed description is alreadyprovided above.

The release slide 402 includes flanges 428 (FIGS. 7E and 7F) and tracks430 (FIGS. 7E and 7F) analogous, respectively, to the flanges 242 andthe tracks 244 of the release slide 202. The release slide may furtherinclude a coupling structure 418 for coupling the release slide 402 tothe handle 304 (shown in FIGS. 5A and 5B) in a manner analogous to thecoupling structure 203 of the release slide 202.

The release slide 402 includes a disengagement arm 414 (FIGS. 7C-7F)having an interfacing section 420 (FIGS. 7E and 7F) and an opening 416(FIGS. 7E and 7F). The disengagement arm 414 may fit at least partiallywithin a passage 440 (FIG. 7F) when the release slide 402 is in itslatched position. When the release slide 402 is in its latched position,the engagement pin 407 extends through the opening 416 such that thecage recess 104 may engage the engagement pin 407.

As the release slide 402 is moved from its latched position to itsunlatched position, the interfacing section 420 may interface with asurface 409 (FIGS. 7C-7F) of the engagement pin 407 such that thedisengagement arm 414 resiliently protracts relative to the housing 404,e.g., bends resiliently away from a longitudinal midline of the housing404 or downward. In some embodiments, the surface 409 may include aramped surface. Alternately or additionally, the disengagement arm 414may interface with surfaces of the housing 404 not on the engagement pin407 that urge the disengagement arm 414 to protract relative to thehousing as the release slide 402 is moved from its latched position toits unlatched position.

As the disengagement arm 414 protracts relative to the housing 404, thedisengagement arm 414 may urge the cage tab 106 to resiliently protractrelative to the cage 102, e.g., bends resiliently away from alongitudinal midline of the cage 102. The cage tab 106 may be urged toprotract relative to the cage 102 such that the cage recess 104 isdisengaged from the engagement pin 407 and allows the optoelectronicmodule 400 to be removed from the cage 102.

The latching mechanism of the optoelectronic module 400 may includerelatively few parts, may have a low-profile, and/or may take up arelatively small amount of space. The latching mechanism may have arelatively low cost due at least in part to its simple design and itsrelatively few parts.

The present invention may be embodied in other specific forms withoutdeparting from its spirit or essential characteristics. The describedembodiments are to be considered in all respects only as illustrativeand not restrictive. The scope of the invention is, therefore, indicatedby the appended claims rather than by the foregoing description. Allchanges which come within the meaning and range of equivalency of theclaims are to be embraced within their scope.

What is claimed is:
 1. A module comprising: a housing including a firstrib located on a first side of the housing and a second rib located on asecond side of the housing; and a release slidingly positioned at leastpartially on the housing, the release slide including: a release slide;a first arm extending from the release slide, the first arm at leastpartially positioned on the first side of the housing, the first armincluding a first flange positioned at least partially over the firstrib; and a second arm extending from the release slide, the second armat least partially positioned on the second side of the housing, thesecond arm including a second flange positioned at least partially overthe second rib.